This system can automatically inspect and sort the wafers to be used for production. It has several intelligent functions, such as deep learning, machine vision, fault alert and factory MES interface.
Average capacity up to 8500 wafers/hour proven in actual mass production
The system can work with carriers loading 25 to 150 wafers and it can be integrated with a wafer cleaner
Double-deck trays, reducing the operation time of worker
Prompt after-sales service and low maintenance cost
High speed profile sensors are applied for thickness measuring module and high-resolution cameras are used for size and stain inspection modules to improve the precision of inspection
The lateral sides in X and Y direction are inspected to minimize any missing detection of defects; micro-cracks cannot escape detection due to the accurate inspection of micro-crack module in X direction.