Fill the gap of high-end die bonder in the domestic market and meet the requirement of end users for high production efficiency and great product consistency

Targeting conventional semiconductor IC packaging customers, our Automatic Epoxy Die Bonder BM312A boasts high accuracy, high efficiency, high reliability, and high flexibility.This machine is specifically designed for mid-to-high-end IC packaging, and is ideal for 12" wafers and large-sized and high-density leadframes. The die placement accuracy is ±25μm, and the epoxy placement accuracy is ±5μm, ensuring packaging quality and stability.

The linear motor drive and intelligent vision algorithms enable millisecond-level response and real-time temperature drift compensation, significantly increasing production efficiency to 20K pcs per hour.Additionally, the modular design and active vibration suppression technology ensure long-term reliability and ease of maintenance, meeting customers' diverse needs for high quality, high capacity, and low maintenance costs.