Automatic Epoxy Die Bonder
BM303A Automatic Epoxy Die Bonder is a highly stable and precise equipment which can serve as a fast and efficient die bonding solution for integrated circuits (including the consumer electronics and automotive electronics).
  • Wafer size

    6-12 inches

  • Die size

    0.15mm * 0.15mm~ 20mm*20mm

High-end and cost-effective substitute
Fill the gap of high-end die bonder in the domestic market and meet the requirement of end users for high production efficiency and great product consistency



No.3 Xinhua Road,
New District, Wuxi, Jiangsu

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