ATW’s Innovative Copper Paste Printing Technology Drives Cost Reduction and Efficiency in the PV Industry

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MAR. 8, 2026

As photovoltaic cell technologies rapidly evolve, improving conversion efficiency while reducing LCOE has become a key industry goal. Traditional silver-based metallization relies heavily on precious silver, leading to high material costs and increasingly limiting large-scale expansion and competitiveness.

To address this challenge, ATW has developed an integrated copper paste / silver-coated copper paste printing solution for TOPCon and BC cells. This system-level metallization innovation for next-generation solar cells helps customers achieve the optimal balance between efficiency, cost, and production line stability.

Core Advantages

High Throughput

An innovative parallel dual-head printing structure achieves CT ≤ 0.68 s (182 format) at 400/1400 printing and snap-off speeds, with dual-lane full wafer output reaching up to 10,400 wafers per hour, ensuring high-speed and stable production.

High Precision

Printing/overlay accuracy ≤ ±6 μm. Built on a fully closed-loop control system with a high-rigidity linear platform, intelligent CCD alignment, and AI-based automatic offset detection and compensation, it fully supports SMBB, 0BB, and ultra-fine grid printing for TOPCon and BC cells, ensuring reliable precision for high-efficiency architectures.

High Yield

Integrated printing AOI and AI-based offset detection with compensation, combined with MES-enabled wafer-level traceability, form a closed-loop quality management system from printing to curing, significantly improving process consistency and product reliability.

High Compatibility

Supports wafer sizes from 182–210 mm (including 210R rectangular formats), with thickness compatibility from 100–180 μm (customizable down to 90 μm). Flexible line layout with a minimum length of just 15.6 meters can be easily adapted for 182/210 half-cell production to meet diverse manufacturing requirements.

Stable Curing Performance

Intelligent temperature control ensures ±5°C uniformity across four tracks for consistent paste curing. Innovative transmission design ensures stable operation, low energy consumption, and improved efficiency.

ATW’s copper paste / silver-coated copper paste printing solution is more than a single equipment upgrade—it represents a comprehensive metallization strategy for TOPCon, BC, and next-generation solar cell technologies. Already applied in large-scale mass production by leading industry players, it helps customers achieve an optimal balance between efficiency improvement and cost control.

Moving forward, ATW will continue driving innovation in PV manufacturing, partnering globally to advance the industry toward higher efficiency, lower costs, and more sustainable development.