Experience Innovation Up Close - Autowell Showcases Automatic 8” Single Spindle Dicing Saw at CIOE 2025

From September 10–12, the 26th China International Optoelectronic Exposition (CIOE 2025) was grandly held at the Shenzhen World Exhibition & Convention Center. As one of the largest and most comprehensive events covering the entire optoelectronics industry chain, CIOE gathered more than 3,800 leading enterprises from around the world.

At booth 10A700, Autowell (ATW) presented multiple core semiconductor equipment solutions, attracting strong interest and engagement from industry professionals and visitors alike.

Pioneering at the Intersection of Demand, Supply, and Technology

The semiconductor industry is currently undergoing a critical transformation, driven by evolving market demand, restructured supply chains, and accelerating technological breakthroughs.

As a leading intelligent equipment manufacturer, Autowell has been deeply involved in the semiconductor sector for many years, continuously expanding its presence and advancing innovation across the entire semiconductor value chain.

At this year’s CIOE, Autowell’s subsidiary—Liduo Technology— made an impressive debut, showcasing a range of its latest semiconductor equipment, including wafer dicing machines, wafer cleaner, soft solder die bonders, thick aluminum wire bonders, and AOI machines—each highlighting the company’s latest R&D achievements and engineering capabilities.

Spotlight Exhibit: Automatic 8” Single Spindle Dicing Saw

The automatic 8” single spindle dicing saw drew particular attention at the exhibition. Designed for silicon, SiC, ceramics, glass, QFN, DFN, and other materials, the system delivers exceptional reliability, precision, and durability, meeting the diverse processing needs of advanced semiconductor manufacturing.

In addition to the 8-inch system, Autowell offers complete dicing solutions for 6-inch, 8-inch, and 12-inch wafers, covering both equipment and process technology—enabling customers to achieve higher flexibility and production efficiency across various product lines.

Expanding Semiconductor Capabilities: Cleaning and Beyond

Autowell also exhibited its wafer cleaning systems and a range of cutting samples for 6/8/12-inch wafers. Among them, the LAC200 wafer cleaner—a cost-efficient 8-inch cleaning solution—adopts a dual-fluid water-gas cleaning system, ensuring precise and efficient surface and kerf cleaning for superior process results.

Innovating Toward a Smarter Semiconductor Future

Looking ahead, Autowell will continue to deepen its expertise in semiconductor equipment, leveraging innovation-driven and diversified strategies to expand its global presence. By continuously improving precision, automation, and intelligent control, the company is committed to driving the semiconductor industry toward a new era of high-quality, sustainable growth.