ATW brought its new semiconductor packaging equipment to the exhibition and received great attention. At this exhibition, ATW displayed the AS-WBA60 aluminum wire bonder, which comprehensively used a variety of advanced technologies such as precision ultrasonic transducer, high-speed motion control, high-speed industrial bus, precision optics and electrical detection, combined with self-designed visual detection and vibration suppression algorithms, to achieve highly reliable semiconductor chip lead welding and tension online detection. Its AS-WBA60 aluminum wire bonder #3366ff;"">The repeat positioning accuracy can reach 3um, the production capacity is 9k/h, and it is compatible with 2-20mil aluminum wire and aluminum strip. All technical indicators are comparable to those of foreign first-line equipment, realizing the technical localization of high-end aluminum wire bonding machines. At the same time, this equipment is easy to install, use and maintain, which can meet the end users' requirements for high production efficiency and high product consistency, and also reduce the total cost of users from equipment procurement to later use and maintenance.

丨AS-WBA60Aluminum Wire Bonding Machine

- Compatible with 2-20mil aluminum wire and aluminum strip -

- Support Chinese and English bilingual interface -

- With product information tracking function -

At the exhibition, Autowell demonstrated the operation process of the AS-WBA60 aluminum wire bonder and shared the relevant technical principles, attracting many customers and experts in the semiconductor field to visit and communicate. Many leading companies in the packaging and testing industry have shown great interest in the excellent performance of Autowell's equipment and hope to have further exchanges and cooperation after the exhibition.

Since its establishment, ATW has always been deeply engaged in the research and development and manufacturing of high-end intelligent equipment, and has achieved certain results in the photovoltaic and lithium battery industries, especially photovoltaic module equipment with string welding machines as the core, which has always maintained an absolute advantage in the market segment and continued to expand upstream and downstream of the industrial chain.

Looking at the development of ATW, relying on its innovative spirit and hard-core R&D strength, it has been rising steadily, which can be said to be "those who plan far will prosper, and those who plan well will win." Since 2018, ATW has entered the semiconductor industry in a timely manner and started to develop aluminum wire bonding machines, opening up a new business territory. Mr. Li Wen, co-founder and deputy general manager of ATW, said in an interview with the media: "Although my country is the world's major semiconductor packaging and testing base, high-end technology is still in the hands of foreign companies, core equipment relies on imports, and the localization rate is relatively low. Once domestic equipment achieves a breakthrough, it will gain greater market opportunities. ”

AUTEWAY's AS-WBA60 aluminum wire bonder has been verified for many times by the factory's core indicators. All indicators of the equipment are in the leading position in the industry. It has been tested on-site by customers at the beginning of the year. It is currently operating well with a yield rate of more than 99.95%. This marks that AUTEWAY has officially entered the semiconductor industry and opened the era of localization of high-end aluminum wire bonders. It is believed that the new aluminum wire bonder launched by AUTEWAY will become a new force in the domestic semiconductor packaging bonding link. AUTEWAY will continue to pay attention to the needs of semiconductor segments and conduct in-depth research and development, extend to the core equipment in the packaging field, and strive to become a comprehensive intelligent equipment service provider with comprehensive layout and global products!