BC Laser Ablation Equipment (RM-LA-BC-5000, New Machine)

LA-BC-5000 adopts high-accuracy and low thermal damage laser processing technology to precisely complete core processes such as patterned dielectric ablation, laser contact opening, and edge isolation on the rear side of cells. The processed area has neat boundaries, no thermal burns, and no substrate damage, effectively ensuring the passivation effect and conductivity of the cells. The equipment is ideal for the high-speed mass production of full-size ultra-thin wafers, and supports various BC cell mass production processes, helping customers achieve efficient cell performance improvement and enhance product market competitiveness, thereby adapting to the scaled iterative production of new-generation high-efficiency PV cells.