Laser Enhanced Metallization Machine DM630

This equipment is deployed after screen printing and before conventional sintering process (or to fully replace the firing furnace). By precisely controlling laser energy density, pulse width, and scanning path, this system is capable of heating only the silver or aluminum paste area for just a few milliseconds (peak temperature reaching 800–950℃), melting the glass phase in the paste and penetrating the silicon nitride passivation layer to form a low-resistance electrical contact with the silicon substrate, while maximizing the protection of the surface passivation structure in the unexposed areas (such as poly-Si/SiOx in TOPCon cells or a-Si:H in HJT cells). The machine integrates green/infrared fiber lasers, high-speed galvano scanners, coaxial vision positioning, and infrared temperature feedback control.

• Significantly enhanced performance (Voc increase of 2–5 mV and FF improvement of 0.2–0.5%)
• Ultra-fast response and high efficiency (processing time per cell <0.7s, throughput matching production line speed >5200 pcs/hour)

• Cell size: 182mm (M10) to 210mm (G12)
• Cell thickness: 100–180 μm (support 80 μm ultra-thin cells)
• Laser type: Fiber laser (1064 nm), average power 50–100 W
• Spot size: 100–1500 μm (adjustable)