Its concise HMI interface makes operation more convenient. It is equipped with self-diagnosis function and provides more comprehensive alarm information

It has the function of damaged wafer collection and unload failure detection to improve the equipment stability and uptime

The combination of AI algorithm and traditional algorithm for Stain, Micro-crack and Chipping inspection makes the test result measureable, stable and reliable.

Experienced in tailored solution, we can design the wafer loading and unloading method according to the needs of customer. Automatic supporting equipment is optional for wafer unloading.