300mm Wafer final polisher

Semiconductor Products

The FTB300FP CMP Tool is jointly developed by JieXin and a Japanese technical team. This equipment is designed for high throughput and cost-effectiveness while improving planarization performance to meet higher technical requirements (GBIR, SFQR).

Wafer Size

≤12 inches
GBIR

＜100nm
Load&Unload

Dry in wet out

High-end domestic substitute of choice

Reliability and stability-driven high-end domestic substitute

High Throughput

Equipped with 8 polishing heads and 3 workstations for enhanced productivity.
Flexible Process Integration

The robotic unloader can be combined with the cleaning system for drying treatment.
Low Overall Cost

The consumables are easy to replace, have a long service life, and thus reduce downtime.

≤12 inches

＜100nm

Dry in wet out