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Semiconductor Products

300mm Wafer final polisher

 
The FTB300FP CMP Tool is jointly developed by JieXin and a Japanese technical team. This equipment is designed for high throughput and cost-effectiveness while improving planarization performance to meet higher technical requirements (GBIR, SFQR).
300mm Wafer final polisher

  • Wafer Size

    ≤12 inches

  • GBIR

    ＜100nm

  • Load&Unload

    Dry in wet out
High-end domestic substitute of choice
Reliability and stability-driven high-end domestic substitute
  • High Throughput
    Equipped with 8 polishing heads and 3 workstations for enhanced productivity.
  • Flexible Process Integration
    The robotic unloader can be combined with the cleaning system for drying treatment.
  • Low Overall Cost
    The consumables are easy to replace, have a long service life, and thus reduce downtime.