300mm Wafer final polisher

Semiconductor Products

The FTB300FP CMP Tool is jointly developed by JieXin and a Japanese technical team. This equipment is designed for high throughput and cost-effectiveness while improving planarization performance to meet higher technical requirements (GBIR, SFQR).

High Throughput

Equipped with 8 polishing heads and 3 workstations for enhanced productivity.
Flexible Process Integration

The robotic unloader can be combined with the cleaning system for drying treatment.
Low Overall Cost

The consumables are easy to replace, have a long service life, and thus reduce downtime.