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Semiconductor Products

300mm Wafer final polisher JX300FP

 
The JX300FP is a leading 12-inch CMP Tool developed based on ATW JX's advanced CMP technology, in response to cutting-edge industry demands. This equipment is equipped with high-performance polishing units and integrates advanced combined cleaning technology, delivering superior cleaning results. It enables nanometer-level global planarization of substrates, meeting the requirements of advanced process technologies.
300mm Wafer final polisher JX300FP

  • Wafer Size

    ≤12 inches

  • GBIR

    ＜100nm

  • Polishing Head

    3-8Zone

  • Load&Unload

    Dry in dry out
Transcending conventional approaches
Integrating polishing and cleaning into one, and combining technological advantages, with stability as the cornerstone and innovation as the cutting edge
  • High Throughput
    Featuring 8 polishing heads and 3 workstations for enhanced productivity.
  • Multi-zone Polishing Head
    Adjustable pressure for 3 to 8 zones, enabling high-precision surface profile control.
  • Integrated Cleaning Unit
    Equipped with advanced cleaning technology, ensuring dry-in and dry-out processing.