Semiconductor Products
Aluminum Wire Bonder
B301D/B301B/B301C Aluminum Wire Bonder is a highly stable and precise equipment which can serve as a fast and efficient bonding solution for power transistors (including the automotive electronics and home appliances industries).
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Al Wire
4~20MIL
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Al Ribbon
20*4~80*10
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UPH
9K
Smart Bonder of China
The wire bonder developed by ATW Coshin filled the gap of high-end bonding system for semiconductor assembly and test in the domestic market
The wedge bonder for leadframe is mainly used in conventional power device packaging applications, meeting the customer’s needs for Al wire and Al power ribbon bonding. The equipment boasts high speed, high yield, and high stability, and is suitable for over 90% of the market's process scenarios, ensuring that every penny invested in the equipment is well spent.
The wedge bonder for leadframe is mainly used in conventional power device packaging applications, meeting the customer’s needs for Al wire and Al power ribbon bonding. The equipment boasts high speed, high yield, and high stability, and is suitable for over 90% of the market's process scenarios, ensuring that every penny invested in the equipment is well spent.
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Strong Compatibility -
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High Capacity -
Low O&M cost -
High-end Intelligence -
Efficient Services