Aluminum Wire Bonder

Semiconductor Products

B301D/B301B/B301C Aluminum Wire Bonder is a highly stable and precise equipment which can serve as a fast and efficient bonding solution for power transistors (including the automotive electronics and home appliances industries).

Al Wire

4~20MIL
Al Ribbon

20*4~80*10 UPH9K

Smart Bonder of China

The wire bonder developed by ATW Coshin filled the gap of high-end bonding system for semiconductor assembly and test in the domestic market

Strong Compatibility

Suitable for Al wire and Al ribbon processes
Ideal for products for multiple application scenarios such as TO series, IPM, IGBT, etc.
High Capacity

High capacity
TO252-4R leadframe
UPH up to 9K/H
Low O&M cost

Self-developed control system enables easy upgrade and maintenance
High-end Intelligence

BPM, GBS, ALC, and other functions facilitate easy operation
Efficient Services

Quick response within 2H
24/7 technical support

4~20MIL

20*4~80*10 UPH9K

204~8010 UPH9K