Semiconductor Products
Automatic 12" Twin Spindle Dicing Saw LFD7100
LAD7100 is a fully automatic 12" twin spindle dicing saw that supports various processes such as full cut and half cut, offers greater dicing efficiency and automatic wafer cleaning, and meets the throughput and quality requirements of customer.
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Y axis positioning accuracy
0.002MM/310mm
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Workpiece size
up to 12"
Fully automatic and highly efficient dicing
Highly efficient wafer dicing, excellent hardware quality and continuously upgraded software system, enabling customer to dice wafers efficiently.
For customers in the semiconductor, optical module, and LED industries that require precise dicing process, we provide 8" dicing saw, wafer cleaning machine, associated consumables, and comprehensive dicing process solutions.
LFD7100 is a fully automatic 12" twin spindle dicing saw designed for dicing workpieces up to 12". Featuring two high-power facing spindles, special microscopes on both Z1 and Z2 axes, and NCS and BBD for standard version, coupled with automation from loading, alignment, dicing, cleaning to unloading, it can significantly reduce the time required for alignment, inspection, and loading/unloading, thereby lowering labor costs and improving production efficiency.
For customers in the semiconductor, optical module, and LED industries that require precise dicing process, we provide 8" dicing saw, wafer cleaning machine, associated consumables, and comprehensive dicing process solutions.
LFD7100 is a fully automatic 12" twin spindle dicing saw designed for dicing workpieces up to 12". Featuring two high-power facing spindles, special microscopes on both Z1 and Z2 axes, and NCS and BBD for standard version, coupled with automation from loading, alignment, dicing, cleaning to unloading, it can significantly reduce the time required for alignment, inspection, and loading/unloading, thereby lowering labor costs and improving production efficiency.
