Automatic 12" Twin Spindle Dicing Saw LFD7100

Semiconductor Products

LAD7100 is a fully automatic twin spindle 12" dicing saw that supports various processes such as full cut and half cut, offers greater dicing efficiency and automatic wafer cleaning, and meets the throughput and quality requirements of customer.

Y axis positioning accuracy

0.002MM/310mm
Workpiece size

up to 12"

Fully automatic and highly efficient dicing

Highly efficient wafer dicing, excellent hardware quality and continuously upgraded software system, enabling customer to dice wafers efficiently.

Highly efficient

Twin spindles work together to dice 12" wafers automatically and efficiently, leading to shorter cycle times.
Fully automatic

Automatic wafer loading and unloading, automatic wafer cleaning, less workers required.
Highly adaptable

NCS (Non-contact Setup) and BBD (Blade Breakage Detection) are standard features.
Easy to use

User-friendly operation interface, upgrade of software as requested by customer, easy for customer to import.

0.002MM/310mm

up to 12"