Automatic 8" Single Spindle Dicing Saw LAD5100

Highly stable system, excellent hardware quality and continuously upgraded software system, satisfying 7*24 production requirement of customer.

For customers in the semiconductor, optical module, and LED industries requiring precise dicing process, we provide 8’’ dicing saw, wafer cleaning machine, associated consumables, and comprehensive dicing process solutions.LAD5100 is an automatic 8’’ single spindle dicing saw designed for dicing workpieces up to 8’’. It features a high-power 1.8KW DC spindle, a high-rigidity gantry structure, imported high-precision screw drives and guide rails, dual-lens switching and alignment, which are further enhanced by self-developed software, so as to meet various customer processing needs.