Automatic High speed Epoxy Die Bonder

Semiconductor Products

BM312A Automatic Epoxy Die Bonder is a highly stable and precise equipment which can serve as a fast and efficient die bonding solution for integrated circuits (including the consumer electronics and automotive electronics).

Wafer size

6-12 inches
Die size

0.2*0.2mm-15*15mm

High-end and cost-effective substitute

Fill the gap of high-end die bonder in the domestic market and meet the requirement of end users for high production efficiency and great product consistency

High output

UPH up to 20K
Strong compatibility

Suitable for 12 inch and smaller wafer and multiple frames
Outstanding reliability

Equipped with Poka-yoke function before loading, inline measurement and auto compensation of dispensed volume, inline inspection and correction of die position after bonding
Great convenience

Adjust the workholder automatically to fit the size of leadframe and make auto wafer feed possible

6-12 inches

0.2*0.2mm-15*15mm

0.20.2mm-1515mm