DB/WB AOI Machine BM310B

Semiconductor Products

BM310B is mainly applied to the appearance inspection of semiconductor discrete devices, integrated circuits and LEDs, and makes it possible to measure the dimensions of die, wire, AI strip, Clip, bond and detect their defects

Leadframe size

25-100mm
False call rate

≤0.05%

Precision measurement and detection

Gain customer recognition for high-precision detection performance and reliable automation integration

Excellent accuracy

Inspection accuracy ±3μm@3σ
High efficiency

≥30K for DFN products
Strong compatibility

Support the inspection of Au/Cu/Al wire products; serve semiconductor and LED industries
Outstanding reliability

AI algorithms help to reach a false call rate of ≤0.05%

25-100mm

≤0.05%