Hybrid Aluminum Wedge Bonder

Semiconductor Products

B307A Hybrid Wedge Bonder is a multifunction, highly stable wedge bonder that provides efficient and high-yield bonding for automotive-grade and industrial modules.

Al Wire

4~20mil
Al Ribbon

20*4mil~80*10mil

Strong Compatibility

Suitable for Al wire and Al ribbon processes
Multiple Application Scenarios

Ideal for IGBT, laser module, on-board charger module, and other scenarios
Process Support

Extensive experience in process applications guarantees the enduring success and reliability of your products
High-end Intelligence

BPM, GBS, ALC, and other functions facilitate easy operation

4~20mil

20*4mil~80*10mil

204mil~8010mil