Semiconductor Products

Hybrid Aluminum Wedge Bonder

B307A Hybrid Wedge Bonder is a multifunction, highly stable wedge bonder that provides efficient and high-yield bonding for automotive-grade and industrial modules.

Al Wire

4~20mil
Al Ribbon

20*4mil~80*10mil

The Hybrid Wedge Bonder is primarily used for IGBU modules, and extends to applications such as laser modules and charging pile modules. The equipment can meet the process requirements for Al wire, Al power ribbon, Cu wire, and Cu power ribbon. The bondhead can be quickly switched within 60 minutes, ensuring high stability for the customer.

Strong Compatibility

Suitable for Al wire and Al ribbon processes
Multiple Application Scenarios

Ideal for IGBT, laser module, on-board charger module, and other scenarios
Process Support

Extensive experience in process applications guarantees the enduring success and reliability of your products
High-end Intelligence

BPM, GBS, ALC, and other functions facilitate easy operation

Hybrid Aluminum Wedge Bonder

4~20mil

20*4mil~80*10mil

204mil~8010mil