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Semiconductor Products
Hybrid AOI Machine BM311B
 
BM311B Hybrid AOI Machine is mainly applied to the appearance inspection of power semiconductor modules, IPMs, substrates and AMB products, and makes it possible to measure the dimensions of die, wire, bond, DBC, Pin and detect their defects
  • Module size

    Max 400*400mm

  • False call rate

    ≤2%

Fast and accurate
Win customer recognition for outstanding detection performance and reliable automation integration