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Semiconductor Products

Hybrid AOI Machine BM311B

 
BM311B Hybrid AOI Machine is mainly applied to the appearance inspection of power semiconductor modules, IPMs, substrates and AMB products, and makes it possible to measure the dimensions of die, wire, bond, DBC, Pin and detect their defects

  • Module size

    Max 400*400mm

  • False call rate

    ≤2%
Fast and accurate
Win customer recognition for outstanding detection performance and reliable automation integration

For the core needs of power module packaging customers regarding product surface quality during the production process, we have launched process inspection AOI machine. Leveraging the differentiated technological advantages of AI + conventional algorithms and AI-assisted programming, it ensures a miss rate of 0%, helping customers strictly control surface quality risks throughout the entire production process, thereby steadily improving product yield and market reputation.