Multifunction Die Bonder

Semiconductor Products

BM313A Multifunction Die Bonder is mainly designed for the die bonding of semiconductor SiC pressure-assisted Ag sintering products, and can be extended to the die bonding of optical modules, sensors and metal packages in the future.

UPH

Up to 1000
Accuracy

±10μm@3σ
Wafer Size

≤12 inches
Bond Force

30kg

High-end domestic substitute of choice

Gain customer confidence and preference with high-speed and high-accuracy die bonding, modular design for flexible configuration, and stable and reliable performance

Precise control

High-accuracy X/Y/Z control, closed-loop and programmable force and temp control, auto accuracy calibration system, multi-function camera system
Modular design

Preheating module, static Gel-Pak, Feeder loading, fully automatic wafer load/unload system (optional)
Intelligent display

Visualized Mapping, visualized force control curve, visualized die bonding accuracy output

Up to 1000

±10μm@3σ

≤12 inches

30kg