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Semiconductor Products

Soft Solder Die Bonder

 
BM314A Soft Solder Die Bonder is mainly applied to the die bonding of power semiconductor devices, and is ideal for power devices and PV modules, such as TO series, DPAK series, PDFN series, DFT modules, etc.
Soft Solder Die Bonder

  • UPH

    Up to 9K

  • Accuracy

    ±35μm@3σ

  • Wafer Size

    ≤12 inches

  • Oxygen Content

    ≤30mm
Optimal solution for the packaging of high-power devices
Outstanding tin writing and spanking effect, cutting-edge track temperature control system, capable of high-speed and high-accuracy die bonding and handling high-density leadframes
  • Ultra-thin wafer handling
    Innovatively developed a high-precision bond head featuring full-travel constant force control for accurate control of both pickup and bonding force
  • Core indicator control
    Oxygen content ≤20ppm, track heating temperature difference ≤±1℃, die placement accuracy ±35μm, tilt ＜30μm
  • Modular design
    Interchangeable tin writing and spanking modules, auto wafer load/unload, multiple loading modes
  • Visualized system
    IQC data monitoring system, production report generation system, bond force control curve simulation system