Semiconductor Products

Ultra Thin Quartz Wafer Laser Cutting Machine RM-LD-Ultra-100

Ultra Thin Quartz Wafer Laser Cutting Machine RM-LD-Ultra-100

Workpiece

Ultra-thin quartz wafer
Applicable industry

Electronic component

High-end semiconductor laser equipment

Overcoming Bottlenecks

Overcome the bottleneck issues in conventional cutter wheel cutting of ultra-thin wafers
High Cutting Accuracy

Self-developed core cutting algorithm ensures cutting accuracy (±1.5um)
High Stability

High-stability and reliable wafer transport system
Upgradable Capability

This equipment can be upgraded to cut transparent and brittle materials such as sapphire and glass