Semiconductor Products

Ultra Thin Quartz Wafer Laser Cutting Machine RM-LD-Ultra-100

Romic Quartz Wafer Laser Cutting Machine is equipped with a non-diffractive precision optical system and femtosecond cold processing technology, capable of stably cutting quartz wafers into 3225, 1210, and 1008 dies. Compared to conventional blade dicing, this method completely eliminates defects such as chipping, micro-cracks, and wafer cracking. It significantly increases the cutting speed, thereby effectively improving both output rate and mass production yield, and significantly reducing the overall manufacturing cost of precision processing for ultra-thin quartz wafers.

Workpiece

Ultra-thin quartz wafer
Applicable industry

Electronic component

Ideal for ultra-thin wafer

As thin as 25um
Self-developed Core Module

Coaxial non-diffractive optical module
Process Upgrade

Output rate improved by 25%

High-end semiconductor laser equipment

Overcoming Bottlenecks

Overcome the bottleneck issues in conventional cutter wheel cutting of ultra-thin wafers.
High Cutting Accuracy

Self-developed core cutting algorithm ensures cutting accuracy (±1.5um).
High Stability

High-stability and reliable wafer transport system.
Upgradable Capability

This equipment can be upgraded to cut transparent and brittle materials such as sapphire and glass.

Ultra Thin Quartz Wafer Laser Cutting Machine RM-LD-Ultra-100

Ultra-thin quartz wafer

Electronic component

As thin as 25um

Coaxial non-diffractive optical module

Output rate improved by 25%