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Semiconductor Products
Wafer Cleaner LAC200
LAC200 is an economical 8" wafer cleaning machine designed to clean wafers cut with a dicing saw. Leveraging the atomizing system, the cleaner can generate high-pressure mist droplets to hit and clean the workpiece surface and the dicing street.
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Wafer size
6", 8"
Compact and neatEconomical cleaner, small footprint, low energy consumption and outstanding cleaning effect/performance.
LAC200 is an 8" wafer clean cleaner designed to clean up to 8" wafers cut with a dicing saw. Leveraging the atomizing system, the cleaner can generate high-pressure mist droplets to clean the workpiece surface and the dicing street. It is used in conjunction with an automatic dicing saw for the cleaning and drying process after dicing.
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