The wire bonder developed by ATW Coshin filled the gap of high-end bonding system for semiconductor assembly and test in the domestic market

The wedge bonder for leadframe is mainly used in conventional power device packaging applications, meeting the customer’s needs for Al wire and Al power ribbon bonding. The equipment boasts high speed, high yield, and high stability, and is suitable for over 90% of the market's process scenarios, ensuring that every penny invested in the equipment is well spent.