LAD7100 is a fully automatic twin spindle 12"" dicing saw that supports various processes such as full cut and half cut, offers greater dicing efficiency and automatic wafer cleaning, and meets the throughput and quality requirements of customer.
Y axis positioning accuracy
0.002MM/310mm
Workpiece size
up to 12"
Fully automatic and highly efficient dicing
Highly efficient wafer dicing, excellent hardware quality and continuously upgraded software system, enabling customer to dice wafers efficiently.
Highly efficient
Twin spindles work together to dice 12"" wafers automatically and efficiently, leading to shorter cycle times.
Fully automatic
Automatic wafer loading and unloading, automatic wafer cleaning, less workers required.
Highly adaptable
NCS (Non-contact Setup) and BBD (Blade Breakage Detection) are standard features.
Easy to use
User-friendly operation interface, upgrade of software as requested by customer, easy for customer to import.
+86-0510-81816658
sales@wxautowell.com
No.3 Xinhua Road,
